发明名称 |
IDENTIFICATION OF DIES ON A SEMICONDUCTOR WAFER |
摘要 |
A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer. |
申请公布号 |
US2012319307(A1) |
申请公布日期 |
2012.12.20 |
申请号 |
US201113160885 |
申请日期 |
2011.06.15 |
申请人 |
WANG SHEN;FABINSKI ROBERT P.;DORAN JAMES E.;PACE LAUREL J.;MEISENZAHL ERIC J. |
发明人 |
WANG SHEN;FABINSKI ROBERT P.;DORAN JAMES E.;PACE LAUREL J.;MEISENZAHL ERIC J. |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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