发明名称 LED Light Emitting Module and Manufacturing Method thereof
摘要 An LED light-emitting module and a manufacturing method thereof are provided. The LED light-emitting module comprises a substrate provided with at least one LED core, wherein the substrate has an interlayer made of ceramic materials and coated with copper foils at two sides; the copper foil at one side of the interlayer is etched to form at least one soldering pad and a conductor; the number of the soldering pads is equal to that of the LED cores; each LED core is fixed on one soldering pad; and one pole of the LED core is welded on the soldering pad while the other pole is connected with an adjacent soldering pad or the conductor through a gold thread.
申请公布号 US2012319158(A1) 申请公布日期 2012.12.20
申请号 US201013509728 申请日期 2010.11.17
申请人 JIN BAOYU;YANG GANG 发明人 JIN BAOYU;YANG GANG
分类号 H01L33/62 主分类号 H01L33/62
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