Method for loading support plate for mounting semiconductor chip, involves heating chip contacts by the heat of laser radiation portion in the optical waveguide of positioning element

摘要

The method involves providing a positioning element (4) with an optical waveguide (4b) and a vacuum port (4a). The semiconductor chip (1) is picked-up by suction of vacuum port of positioning element. The semiconductor chip is placed on a mounting portion (2c) of a support plate (2) provided with surface conductors (2a,2b). The chip contacts (1a,1b) of semiconductor chip are mechanically mounted on the mounting portion of support plate. The chip contacts are heated by the heat of laser radiation portion (6) in the optical waveguide of positioning element. An independent claim is included for positioning element.