| 摘要 |
<p>Provided is an adhesive film suitable for applications in which said film is cut by a short-wavelength laser having a main wavelength of 1.0-1.1 µm. This adhesive film (1) comprises a resin film (10) as a base material, and an adhesive layer (20) disposed on at least one surface of the resin film (10). The base material (10) has a laser light absorption rate of at least 20% within the wavelength range of 1,000-1,100 nm and includes a laser light absorption layer (42) comprising a resin composition including carbon black (402) as a laser light absorbent that increases the laser light absorption rate.</p> |
