| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ball grid array presentation apparatus and a workpiece presentation apparatus and a workpiece presentation method which automatically grip and arrange small size solder balls. <P>SOLUTION: An apparatus 100 has a stationary guard 120 defining a first passage. A core 112 is located adjacent to the stationary guard 120 and is movable between an unload position and a second position. The core 112 defines a second passage and supports a workpiece fixture 116 operatively holding a ball grid array. In the unload position of the core 112, the second passage is operatively positioned relative to the first passage, and the arrangement makes the ball grid array accessible for unloading the ball grid array from the workpiece fixture 116. In the second position of the core 112, the second passage is operatively displaced from the first passage, and the core 112 and the stationary guard 120 cooperate and form an enclosure around the workpiece fixture 116, including supply of balls that are not held in the ball grid array, at the first passage. <P>COPYRIGHT: (C)2013,JPO&INPIT |
