发明名称 MANUFACTURING METHOD OF ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component in which an external electrode can be formed in a thin thickness in a low-profile element body and whose productivity can be improved, and a manufacturing method of the electronic component. <P>SOLUTION: An electronic component 1 includes: an element body 2 having end faces 2a and 2b, main faces 2c and 2d, and side faces 2f and 2e; and external electrodes 3 and 4 formed on the end faces 2a and 2b of the element body 2. The manufacturing method of the electronic component 1 includes an element body preparing step S1 for preparing the element body 2 in which a height dimension T between a pair of main faces 2c and 2d is equal to or less than a half as large as the width dimension W between a pair of side faces 2f and 2e; and a first paste applying step S4 for applying a conductive paste P onto the main faces 2c and 2d at the end face 2a and 2b side by screen printing, and further arranging the conductive paste P up to the end faces 2a and 2b side, so as to apply the conductive paste P across the end face 2a and 2b and the main faces 2c and 2d. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012253077(A) 申请公布日期 2012.12.20
申请号 JP20110122441 申请日期 2011.05.31
申请人 TDK CORP 发明人 SHIRAKAWA YUKIHIKO;INAGAKI TATSUO;SUGIURA YU
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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