发明名称 METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT COMPRISING A CONDUCTOR LAYER IN THE SEMICONDUCTOR BODY AND SEMICONDUCTOR COMPONENT
摘要 A cutout (11) is present in the semiconductor body (1), said cutout penetrating through the semiconductor body. A conductor layer (6), which is electrically conductively connected to a metal plane (3) on or above the semiconductor body, electrically screens the semiconductor body from the cutout. The conductor layer can be metal, if appropriate with a barrier layer (6a), or a doped region of the semiconductor body.
申请公布号 WO2012171742(A1) 申请公布日期 2012.12.20
申请号 WO2012EP59159 申请日期 2012.05.16
申请人 AMS AG;MINIXHOFER, RAINER;STUECKLER, EWALD;SCHREMS, MARTIN;KOPPITSCH, GUENTHER;KRAFT, JOCHEN;TEVA, JORDI 发明人 MINIXHOFER, RAINER;STUECKLER, EWALD;SCHREMS, MARTIN;KOPPITSCH, GUENTHER;KRAFT, JOCHEN;TEVA, JORDI
分类号 H01L21/768;H01L23/48 主分类号 H01L21/768
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