发明名称 |
MAGNETICALLY COUPLED THIN-WAFER HANDLING SYSTEM |
摘要 |
The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system. |
申请公布号 |
US2012321430(A1) |
申请公布日期 |
2012.12.20 |
申请号 |
US201213598935 |
申请日期 |
2012.08.30 |
申请人 |
WIENRICH JEFF;SINGLETON CHARLES |
发明人 |
WIENRICH JEFF;SINGLETON CHARLES |
分类号 |
H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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