| 摘要 |
An apparatus 101 for singulating an object is disclosed. The apparatus 101 comprises a laser 103 configured to emit a laser beam 105 with a Gaussian irradiance profile, as well as a beam-shaping device 115 configured to reshape the Gaussian irradiance profile of the laser beam 105 emitted from the laser 103. In particular, the beam-shaping device 115 has a plurality of aspherical lenses 117, 119 to redistribute irradiance of the laser beam 105, so as to reduce variation of the irradiance in an effective irradiation spectrum of the laser beam 105 for singulating the object. By redistributing the irradiance of the laser beam 105, irradiation energy may be more efficiently delivered to the semiconductor wafer 102 for laser singulation, compared with conventional laser beams with Gaussian irradiance profiles which are non-uniform. A method of singulating an object is also disclosed. |
