发明名称 INTERCONNECT PATTERN FOR HIGH PERFORMANCE INTERFACES
摘要 <p>In one embodiment, differential signaling and ground contacts are located in a rectilinear array of rows and columns with ground contacts spaced apart by three times the pitch distance between adjacent rows or columns and signaling contacts are located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and one contact of each differential pair of contacts is located one pitch distance from a ground contact and the other contact of the differential pair is located approximately sqrt(2)*pitch distance from the same ground contact. In a second embodiment, differential signaling and ground contacts are located in a hexagonal array with ground contacts located three times the pitch distance between adjacent contacts and signaling contacts located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and both contacts of each differential pair of contacts are located one pitch distance from a ground contact.</p>
申请公布号 EP2534675(A2) 申请公布日期 2012.12.19
申请号 EP20110742657 申请日期 2011.02.07
申请人 ALTERA CORPORATION 发明人 HUI, LIU
分类号 H01L21/60;H01L23/48;H01L23/498;H01L23/50;H01R12/70;H01R13/64;H01R13/6471 主分类号 H01L21/60
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