发明名称 |
METAL SUBSTRATE WITH INSULATION LAYER AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, SOLAR CELL AND MANUFACTURING METHOD THEREOF, ELECTRONIC CIRCUIT AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF |
摘要 |
A metal substrate with an insulation layer includes a metal substrate having at least an aluminum base and an insulation layer formed on said aluminum base of said metal substrate. The insulation layer is a porous type anodized film of aluminum. The anodized film includes a barrier layer portion and a porous layer portion, and at least the porous layer portion has compressive strain at room temperature. a magnitude of the strain ranges from 0.005% to 0.25%. The anodized film has a thickness of 3 micrometers to 20 micrometers. |
申请公布号 |
EP2534699(A1) |
申请公布日期 |
2012.12.19 |
申请号 |
EP20110739558 |
申请日期 |
2011.02.02 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
SATO, KEIGO;NAKAYAMA, RYUICHI;YUYA, SHIGENORI;MUKAI, ATSUSHI;SUZUKI, SHINYA;MIYASHITA, YOUTA |
分类号 |
H01L31/04 |
主分类号 |
H01L31/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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