发明名称 METAL SUBSTRATE WITH INSULATION LAYER AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, SOLAR CELL AND MANUFACTURING METHOD THEREOF, ELECTRONIC CIRCUIT AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
摘要 A metal substrate with an insulation layer includes a metal substrate having at least an aluminum base and an insulation layer formed on said aluminum base of said metal substrate. The insulation layer is a porous type anodized film of aluminum. The anodized film includes a barrier layer portion and a porous layer portion, and at least the porous layer portion has compressive strain at room temperature. a magnitude of the strain ranges from 0.005% to 0.25%. The anodized film has a thickness of 3 micrometers to 20 micrometers.
申请公布号 EP2534699(A1) 申请公布日期 2012.12.19
申请号 EP20110739558 申请日期 2011.02.02
申请人 FUJIFILM CORPORATION 发明人 SATO, KEIGO;NAKAYAMA, RYUICHI;YUYA, SHIGENORI;MUKAI, ATSUSHI;SUZUKI, SHINYA;MIYASHITA, YOUTA
分类号 H01L31/04 主分类号 H01L31/04
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