发明名称 |
Copper filled opening with a cap layer |
摘要 |
<p>The invention concerns openings in substrates filled with a copper deposit. Thermal annealing processes lead to an irreversible expansion of said copper deposit and hence to the formation of voids in the copper deposit and cracks between the surface of the substrate and active or passive overlying structures. The present invention provides cap layers which suppress the irreversible expansion of copper during or after thermal annealing.</p> |
申请公布号 |
EP2535441(A1) |
申请公布日期 |
2012.12.19 |
申请号 |
EP20110169738 |
申请日期 |
2011.06.14 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
ROHDE, DR. DIRK;DAMBROWSKY, DR. NINA;GAIDA, JOSEF;UHLIG, DR. ALBRECHT;VAN DEN BOOM, RUUD |
分类号 |
C23C18/16;C23C18/31;C23C18/32;H01L21/768;H01L23/532 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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