| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately mount electronic components onto a circuit board by preventing positional deviation of a semiconductor chip, when flip-chip bonding the semiconductor chip to the circuit board through the application of ultrasonic oscillation. <P>SOLUTION: A method of mounting electronic components is adapted to mount a semiconductor chip 10 onto a circuit board 20 by means of flip-chip bonding, in which bumps 12 and a positioning bump 13 having a larger size and a higher protrusion than those of the bumps 12 are formed on the semiconductor chip 10 and the circuit board 20 is provided with electrode terminals 22 to which the bumps 12 are bonded and a pad 23 to which the positioning bump 13 is bonded. The positioning bump 13 and the pad 23 are bonded while applying ultrasonic oscillation to the semiconductor chip 10, and subsequently, the bumps 12 and the electrode terminals 22 are bonded while applying ultrasonic oscillation to the semiconductor chip 10. <P>COPYRIGHT: (C)2010,JPO&INPIT |
