| 摘要 |
PROBLEM TO BE SOLVED: To reduce the warp of a green sheet generated upon calcination by the difference of a contraction amount when calcining a metallization paste layer and the green sheet in a manufacturing method of a ceramic wiring board composed by calcining the green sheet comprising ceramic for which the metallization paste layer composed of metallization paste is printed on one surface. SOLUTION: Printing is performed by changing the thickness of the metallization paste layer 15a within a surface so that the metallization paste layer 15a printed at the center part of one surface of the green sheets 11a-13a is thinner than the metallization paste layer 15a printed on the outer side of the center part. COPYRIGHT: (C)2009,JPO&INPIT |
