发明名称 |
COMPONENT HAVING A VIA, AND A METHOD FOR PRODUCING THE COMPONENT |
摘要 |
<p>A component including a via for electrical connection between a first and a second plane of a substrate is provided. The substrate has a borehole having an inner wall that is coated with a conductive layer made of an electrically conductive material, an intermediate layer being disposed between the inner wall and the conductive layer. The intermediate layer includes electrically insulating SiC.</p> |
申请公布号 |
EP2380193(B1) |
申请公布日期 |
2012.12.19 |
申请号 |
EP20090737421 |
申请日期 |
2009.10.20 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
TRAUTMANN, ACHIM;MUELLER, THORSTEN |
分类号 |
H01L23/48;H01L21/768;H01L23/498 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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