| 摘要 |
PROBLEM TO BE SOLVED: To form a 3D structure without performing bending work or attachment of a connecting auxiliary member, and to suppress wear of a blade in segmenting a semiconductor device into pieces. SOLUTION: This method of manufacturing a lead frame includes processes of: fixing, on a principal surface of an insulating base material, first metal pieces formed by stamping a first metal plate while intersecting the first metal plate with the insulating base material; and fixing, on the principal surface of the insulating base material, second metal pieces formed by stamping a second metal plate having a thickness different from that of the first metal plate while intersecting the second metal plate with the insulating base material. COPYRIGHT: (C)2011,JPO&INPIT |
