发明名称
摘要 The multilayer semiconductor circuit (100) has a substrate (101) made of silicon. A first porous layer (104) is formed in the central part of the top surface of the substrate. A cavity may be formed under this porous layer, and the cavity may have an external opening to provide access. A second porous layer (105) may be formed under the first, with larger pores. A masking layer (102) may be formed on either side of or surrounding the porous layers.
申请公布号 JP5100949(B2) 申请公布日期 2012.12.19
申请号 JP20020507720 申请日期 2001.04.20
申请人 发明人
分类号 B81C1/00;G01L9/00;B81B3/00;H01L21/306;H01L29/84 主分类号 B81C1/00
代理机构 代理人
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