Vertically mounted multi-hybrid module and heat sink

摘要

A multi-hybrid module (14a, 14b) includes a plurality of hybrid assemblies (18a, 18b) that are perpendicularly mounted with respect to a plane of a circuit board (12a, 12b). The hybrid assemblies (18a, 18b) are mounted on opposing sides of a heat sink (22). The heat sink (22) has a first column (22a) disposed at a first end, a second column (22b) disposed at a second opposing end, and a generally flat center wall (22c) extending between the first column (22a) and the second column (22c) to which the hybrid assemblies (18a, 18b) are mounted. During operation the hybrid assemblies (18a, 18b) are mounted on edge perpendicular with respect to the circuit board (12a, 12b) to minimize an area profile of the multi-hybrid module (14a, 14b) on the circuit board (12a, 12b).