发明名称 |
THIN WAFER CARRIER |
摘要 |
<p>An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.</p> |
申请公布号 |
EP2534677(A2) |
申请公布日期 |
2012.12.19 |
申请号 |
EP20110742666 |
申请日期 |
2011.02.08 |
申请人 |
SUESS MICROTEC LITHOGRAPHY GMBH |
发明人 |
HURLEY, DANIEL;GEORGE, GREGORY |
分类号 |
H01L21/677;B23Q3/08;H01L21/67;H01L21/673;H01L21/687 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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