| 摘要 |
PURPOSE: A both-side sputtering vacuum deposition apparatus and method are provided to implement deposition on a flexible board film with minimized thermal deformation by forming ITO coating on both sides of the flexible board film without a vacuum process. CONSTITUTION: A both-side sputtering vacuum deposition apparatus comprises an unwinding roll(10), a first sputter cathode(11) depositing ITO(Indium Tin Oxide) on one side of a flexible board film, a first cooling drum(12) guiding and cooling the flexible board film, a first direction change roll(13) changing the flexible board film guide from the first cooling drum, a first heating unit(14) crystallizing the one side of the flexible board film deposited with ITO coating, a second direction change roll(15) changing the crystallized flexible board film, one or more second sputter cathodes(16) depositing ITO on the other side of the plastic film, a second cooling drum guiding and cooling the other side of the plastic film deposited with ITO, a second heating unit(18) crystallizing the other side of the flexible board film guided by the second cooling drum, and a winding roll(19).
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