发明名称 |
Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus |
摘要 |
A semiconductor device (100) includes: a substrate (102); a bonding pad (110) provided above the substrate (102); and an inductor (112) provided above the substrate (102) and below the bonding pad (110) for carrying out signal transmission/reception to/from the external in a non-contact manner by electromagnetic induction.
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申请公布号 |
US8334759(B2) |
申请公布日期 |
2012.12.18 |
申请号 |
US20090320054 |
申请日期 |
2009.01.15 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
NAKASHIBA YASUTAKA |
分类号 |
G09F25/00;G01R31/26;H01L21/50;H01L29/82 |
主分类号 |
G09F25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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