发明名称 Semiconductor device and a method of manufacture thereof
摘要 A method of manufacturing a semiconductor device comprises depositing a semiconductor layer over a semiconductor surface having at least one first region with a first (average surface lattice) parameter value and at least one second region having a second parameter value different from the first. The semiconductor layer is deposited to a thickness so self-organized islands form over both the first and second regions. The difference in the parameter value means the islands over the first region have a first average parameter value and the islands over the second region have a second average parameter value different from the first. A capping layer is deposited over islands and has a greater forbidden bandgap than the islands whereby the islands form quantum dots, which have different properties over the first and second regions due to difference(s) between the first and second region islands.
申请公布号 US8334157(B2) 申请公布日期 2012.12.18
申请号 US20080189972 申请日期 2008.08.12
申请人 SMEETON TIM MICHAEL;SMITH KATHERINE LOUISE;SENES MATHIEU XAVIER;HOOPER STEWART EDWARD;SHARP KABUSHIKI KAISHA 发明人 SMEETON TIM MICHAEL;SMITH KATHERINE LOUISE;SENES MATHIEU XAVIER;HOOPER STEWART EDWARD
分类号 H01L21/00;H01L29/06;H01L33/06 主分类号 H01L21/00
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