发明名称 |
Method of forming electrode placement and connection systems |
摘要 |
Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto. |
申请公布号 |
US8333012(B2) |
申请公布日期 |
2012.12.18 |
申请号 |
US20090575674 |
申请日期 |
2009.10.08 |
申请人 |
ROTHE CHRIS A.;GANDIONCO ISIDRO M.;TAM EDMUND;SAADAT VAHID;MILLER DAVID;MALCHANO ZACHARY J.;SWAMINATHAN VEERAPPAN;VOYAGE MEDICAL, INC. |
发明人 |
ROTHE CHRIS A.;GANDIONCO ISIDRO M.;TAM EDMUND;SAADAT VAHID;MILLER DAVID;MALCHANO ZACHARY J.;SWAMINATHAN VEERAPPAN |
分类号 |
H01R43/00 |
主分类号 |
H01R43/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|