发明名称 Light emitting diode and manufacturing method thereof
摘要 A light emitting diode includes a thermal conductive substrate, an p-type GaN layer, an active layer and an n-type GaN layer sequentially stacked above the substrate and an electrode pad deposited on the n-type GaN layer. A surface of n-type GaN layer away from the active layer has a first diffusing section and a second diffusing section. The first diffusing section is adjacent to the electrode pad and the second diffusing section is located at the other side of the first diffusing section opposite to the electrode pad, wherein the doping concentration of the first diffusing section is less than that of the second diffusing section. The n-type GaN layer has an electrical resistance larger than that of the first diffusing section which in turn is larger than that of the second diffusing section.
申请公布号 US8334542(B2) 申请公布日期 2012.12.18
申请号 US20100884217 申请日期 2010.09.17
申请人 LAI CHIH-CHEN;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 LAI CHIH-CHEN
分类号 H01L27/15 主分类号 H01L27/15
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