发明名称 |
LIGHT EMITTING DIODE PACKAGE |
摘要 |
PURPOSE: A light emitting diode package is provided to prevent the light emitting diode from easily falling or tilting by forming a support on a support side. CONSTITUTION: A light emitting diode chip(100) is located on one side of a first lead. The first lead includes a first lead body(210), a first lead extension part(220), a first lead terminal(230), and a lead heat dissipation unit. The lead heat dissipation unit includes a heat dissipation extension part(240) and a heat dissipation contact part(250). A second lead includes a second lead body(310), a second lead extension part(320) and a second lead terminal(330). A housing unit(400) includes an upper housing(410), a lower housing(420), an opening part(430) and a support(450).
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申请公布号 |
KR20120136241(A) |
申请公布日期 |
2012.12.18 |
申请号 |
KR20110055333 |
申请日期 |
2011.06.08 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
LEE, JAE JIN;CHOI, SUNG HO;KANG, DUK IN |
分类号 |
H01L33/54;H01L33/62;H01L33/64 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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