| 摘要 |
PURPOSE: An IR reflow soldering system is provided to simultaneously heating every layer in a solder ball, a PCB(Printed Circuit Substrate), and every electronic component by performing a radiation function. CONSTITUTION: A work station(10) transfers a PCB(1) including components along a transfer line. The work station performs soldering work by emitting multi-wavelength infrared light to a PCB through heating units(60A,60B). The work station includes the transfer line for transferring the PCB including components on the top. The work station includes a free heating zone for emitting the multi-wavelength infrared light for preheating the PCB through the heating units. The work station includes a reflow zone for emitting the multi-wavelength infrared light through heating units to soldering the components.
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