Manufacturing method for contact pads of a thin film transistor array panel, and a thin film transistor array panel having such contact pads

摘要

A thin film transistor array panel includes a first insulation substrate, a plurality of data wires formed on the first insulation substrate and extending in a first direction, a data pad region formed on the first insulation substrate and having plural ones of the data wires extending therefrom, and an organic layer formed on the data wires, where the organic layer has a greater thickness where it is disposed over the data wires than the thickness it has between the data wires. The surface of the organic layer of the data pad region includes minute slit patterns that extend parallel to the first direction of the data wires, and the data wires have line boundaries of a zigzag shape.