SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve electrical characteristics of a semiconductor diode by forming bottom wires arranged between a substrate and the semiconductor diode into metallic material. CONSTITUTION: Bottom wires(150) are arranged on a semiconductor substrate. Top wires(190) cross the bottom wires. Semiconductor pillars(SP) are arranged in a cross region of the bottom wires and the top wires. The each semiconductor pillar comprises a top impurity region of a first conductivity type. A low concentration impurity region is adjacent to high concentration impurity region and the top impurity region.