| 摘要 |
PURPOSE: An etching processing apparatus is provided to reduce costs and time of an etching process by including a plurality of groove in a wafer jig part and inserting a plurality of wafers into the plurality of groove. CONSTITUTION: A crucible(100) accepts a wafer. A wafer jig part(200) comprises the wafer. The wafer jig part is formed which can be rotated. The wafer jig part comprises a plurality of grooves. The plurality of grooves is placed at each edge of the wafer jig part.
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