METHOD FOR FABRICATING PATTERN BURIED SUBSTRATE AND SUBSTRATE THEREBY

摘要

PURPOSE: A pattern buried substrate manufacturing method is provided to insert a prepreg layer between circuit pattern layers by burying an insulating layer between circuit patterns. CONSTITUTION: A first circuit pattern(31) and a second circuit pattern(33) are formed on a first carrier and a second carrier. A first insulating layer(41) filling the space between the first circuit patterns and a second insulating layer(43) filling the space between the second circuit patterns are formed. The first circuit pattern and the second circuit pattern are faced to each other. A prepreg layer is inserted between the first circuit pattern and the second circuit pattern. The first and second carriers are removed from the first and second pattern circuits. The exposed surface of the first and second circuit patterns is covered. A solder resist layer is formed on the first and second insulating layers.