| 摘要 |
PURPOSE: A membrane in a carrier head for successively and continuously polishing a wafer around a partition wall is provided to evenly polish the wafer by interposing a flexible inclusion in a ring-shaped receiving part of the partition wall. CONSTITUTION: A flat plane contacts a wafer to be polished. A ring-shaped receiving part(213S) is extended from the flat plane in order to partition off a chamber along a radial direction. The ring-shaped receiving part is formed to penetrate into the center of a ring-shaped partition wall(213). A material having smaller flexural rigidity than that of the partition wall is included in a ring-shaped flexible inclusion(215). The ring-shaped flexible inclusion is interposed in the ring-shaped receiving part.
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