| 摘要 |
<p>A cyanate ester resin composition for a printed wiring board material containing a cyanate ester resin component A comprising a cyanate ester compound represented by the formula (1) and/or an oligomer thereof, and at least one component B selected from the group consisting of an epoxy resin and a maleimide compound, which resin composition is improved in heat resistance and heat resistance after moisture absorption, is excellent in mechanical properties such as elastic modulus and has flame retardancy without a halogen compound, and
a prepreg and a laminate each of which uses the resin composition defined as above wherein the resin composition contains the component A and at least the epoxy resin as the component B.</p> |
