发明名称 |
RESIST REMOVAL APPARATUS AND RESIST REMOVAL METHOD |
摘要 |
A resist removal apparatus and method are effective in removing a resist without oxidizing the substrate material other than the resist. The resist removal apparatus, which removes resist from a wafer on which a resist film has been formed, includes a cluster spraying unit which sprays a wafer with clusters each of which is formed of a plurality of organic solvent molecules agglomerated together. |
申请公布号 |
US2012312334(A1) |
申请公布日期 |
2012.12.13 |
申请号 |
US201213594412 |
申请日期 |
2012.08.24 |
申请人 |
DOBASHI KAZUYA;FUSE TAKASHI;IWATANI CORPORATION;TOKYO ELECTRON LIMITED |
发明人 |
DOBASHI KAZUYA;FUSE TAKASHI |
分类号 |
B08B3/08 |
主分类号 |
B08B3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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