发明名称 RESIN BASE MATERIAL WITH METAL FILM PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a metal film pattern having excellent adhesion reliability and precision on a resin base material efficiently by using a low concentration metal ion solution. <P>SOLUTION: A resin base material having a metal film pattern is produced by a method including the following steps (a)-(e). (a) A step for printing a pattern of a latent image agent on the surface of the resin base material, (b) a step for generating a metal salt by bringing a solution containing metal ions into contact with a part where the latent image agent is printed, (c) a step for reducing the metal salt by bringing it into contact with an acid processing liquid containing a reductant, (d) a step for forming an electroless nickel plating film at a part where the latent image agent is printed, and (e) a step for making the electroless nickel plating film precipitate on the surface of the nickel plating film. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248770(A) 申请公布日期 2012.12.13
申请号 JP20110121130 申请日期 2011.05.30
申请人 SEIREN CO LTD 发明人
分类号 H05K3/18;B41M1/10;B41M1/30 主分类号 H05K3/18
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