| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents an outer peripheral portion of an insulation sheet from being peeled from a heat sink. <P>SOLUTION: A semiconductor device according to this invention includes: a heat sink having a flat part and a protruding part formed so as to enclose the flat part; an insulation sheet bonded to the flat part and the protruding part so as to be enclosed by the protruding part; a semiconductor element radiating heat to the heat sink through the insulation sheet; and a mold resin covering the heat sink, the insulation sheet, and the semiconductor element so that a surface of the heat sink, which is the opposite side of a surface where the insulation sheet is bonded, is exposed to the exterior. <P>COPYRIGHT: (C)2013,JPO&INPIT |
