METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that prevents crystal defects from occurring in a substrate on which semiconductor chips are mounted and reduces the manufacturing time.

SOLUTION: A method of manufacturing a semiconductor device 101 comprises the steps of: forming a first insulating film 14 on a substrate (for example, a first semiconductor chip 10); forming an opening 14B on the first insulating film 14; mounting a second semiconductor chip 12 inside the opening of the first insulating film 14; forming a second insulating film 16 so as to straddle the second semiconductor chip 12 and the first insulating film 14; and then forming a wiring structure 26 on the second insulating film 16.

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