| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interconnector for a solar cell capable of preventing warpage or cracking of cells even in the solar cell using a silicon cell made into a thin shape. <P>SOLUTION: An interconnector for a solar cell is formed by covering a part or the whole of the surface of a conductive material with an Sn-based solder, and the degree of supercooling of the solder is lower than 25°C. Moreover, in a method of manufacturing the interconnector for the solar cell, the conductive material is covered with the Sn-based solder using a hot dip plating containing Sn of 60 mass% or more, and at least one, selected from among Zn, Mg, Ti, Co, Zr, and Be, of 0.001 mass% or more and 2 mass% or less in total. <P>COPYRIGHT: (C)2013,JPO&INPIT |
