发明名称 HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
摘要 A heterostructure contains an IC and an LED. An IC and an LED are initially provided. The IC has at least one first electric-conduction block and at least one first connection block. The IC electrically connects with the first electric-conduction block. The first face of the LED has at least one second electric-conduction block and at least one second connection block. The LED electrically connects to the second electric-conduction block. Subsequently, the first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block. The first electric-conduction block is electrically connected with the second electric-conduction block and forms a heterostructure. The system simultaneously provides functions of heat radiation and electric communication for the IC and LED resulting in a high-density, multifunctional heterostructure.
申请公布号 US2012313133(A1) 申请公布日期 2012.12.13
申请号 US201113224607 申请日期 2011.09.02
申请人 NATIONAL CHIAO TUNG UNIVERSITY 发明人 CHEN KUAN-NENG;KO CHENG-TA;LO WEI-CHUNG
分类号 H01L33/62;H01L33/48 主分类号 H01L33/62
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