发明名称 METHOD FOR CUTTING PLATE-LIKE GLASS, AND CUTTING DEVICE THEREFOR
摘要 An initial crack (6a) is formed along a planned cutting line (5) on a plate-like glass (G) supported by means of a supporting member (2, 8) from the rear surface side. Subsequently, the initial crack (6a) penetrates to the rear surface from the front surface and spreads by means of the stress generated as a result of locally heating the plate-like glass (5) along the planned cutting line (5) and cooling said heated region. Then, when cutting the entire plate-like glass (G), the plate-like glass (G) is supported by means of the supporting member (2, 8) from the rear surface side with an elastic sheet (E) exhibiting a low thermal conductivity disposed between the plate-like glass (G) and the supporting member (2, 8).
申请公布号 WO2012169025(A1) 申请公布日期 2012.12.13
申请号 WO2011JP63162 申请日期 2011.06.08
申请人 NIPPON ELECTRIC GLASS CO., LTD.;TERANISHI YASUO;MATSUMOTO YASUHIRO;MINARI TAIKI;FURUTA TAKAYA 发明人 TERANISHI YASUO;MATSUMOTO YASUHIRO;MINARI TAIKI;FURUTA TAKAYA
分类号 C03B33/023 主分类号 C03B33/023
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