| 摘要 |
A support device has a pad configured to support a utensil and to wick away a portion of a material that soiled the utensil, and an adhesive coupled to the pad, the adhesive configured to bind the pad to a support surface to resist motion from the utensil. In accordance with an alternative embodiment, an apparatus has a permeation resistant pad configured to support a utensil soiled with a material; an absorbent layer in communication with the permeation resistant pad, the absorbent layer configured to wick a portion of the material into the absorbent layer; a leak resistant backing adjacent the absorbent layer, the leak resistant backing configured to resist a support surface being soiled by the material; and an adhesive contactingly adjacent the teak resistant backing, the adhesive configured to bind the permeation resistant pad on the support surface to resist motion from said utensil. |
