ELECTROCONDUCTIVE BALL MOUNTING APPARATUS AND ELECTROCONDUCTIVE BALL MOUNTING METHOD

摘要

In the present invention, an electroconductive ball mounting apparatus (1) comprises: a depressurization chamber (35) which is disposed between a ball array plate (26) and a depressurization generation unit (32) and is depressurized before electroconductive balls (2) are adhered to the ball array plate (26); and a valve (33) for opening and closing a flow path between the depressurization chamber (35) and the ball array plate (26), the valve being disposed between the depressurization chamber (35) and the ball array plate (26). According to the electroconductive ball mounting apparatus (1), the electroconductive balls (2) can be accurately adhered to the ball array plate (26), the time needed to adhere the electroconductive balls (2) can be shortened, and yield can be improved.