发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows suppressing a cost without complicating a manufacturing process by forming a thin-film transistor using an oxide semiconductor film, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: In a semiconductor device in which a gate electrode is formed on a substrate, a gate insulating film is formed to cover the gate electrode, an oxide semiconductor film is formed on the gate insulating film, and a first conductive film and a second conductive film are formed on the oxide semiconductor film. The oxide semiconductor film has at least a region crystallized in a channel forming region. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248861(A) 申请公布日期 2012.12.13
申请号 JP20120160290 申请日期 2012.07.19
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 AKIMOTO KENGO;HONDA TATSUYA;SONE HIROTO
分类号 H01L21/336;G02F1/1368;H01L21/20;H01L29/786;H01L51/50;H05B33/08 主分类号 H01L21/336
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