发明名称 |
SEMICONDUCTOR EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compound semiconductor epitaxial substrate which is quick in recovery after high frequency signal interruption, and which is excellent in element isolation characteristics. <P>SOLUTION: A semiconductor epitaxial substrate comprises: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer. A boundary face between the AlN layer and nitride semiconductor layer has a larger irregularity than that of a boundary face between the single crystal substrate and the AlN layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012248890(A) |
申请公布日期 |
2012.12.13 |
申请号 |
JP20120191565 |
申请日期 |
2012.08.31 |
申请人 |
FUJITSU LTD;HITACHI CABLE LTD |
发明人 |
IMANISHI KENJI;YOSHIKAWA SHUNEI;TANAKA TAKESHI;MORIYA YOSHIHIKO;OTOGI YOHEI |
分类号 |
H01L21/338;H01L21/205;H01L29/778;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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