发明名称 SEMICONDUCTOR EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a compound semiconductor epitaxial substrate which is quick in recovery after high frequency signal interruption, and which is excellent in element isolation characteristics. <P>SOLUTION: A semiconductor epitaxial substrate comprises: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer. A boundary face between the AlN layer and nitride semiconductor layer has a larger irregularity than that of a boundary face between the single crystal substrate and the AlN layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248890(A) 申请公布日期 2012.12.13
申请号 JP20120191565 申请日期 2012.08.31
申请人 FUJITSU LTD;HITACHI CABLE LTD 发明人 IMANISHI KENJI;YOSHIKAWA SHUNEI;TANAKA TAKESHI;MORIYA YOSHIHIKO;OTOGI YOHEI
分类号 H01L21/338;H01L21/205;H01L29/778;H01L29/812 主分类号 H01L21/338
代理机构 代理人
主权项
地址