| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a shield case or the like which prevents a thermosetting adhesive from flowing into a predetermined region on a circuit board when the shield case is fixed on the circuit board on which an electronic component is mounted and also prevents variations in performance of electronic apparatuses. <P>SOLUTION: In an electronic apparatus 1, a shield case 10 is fixed on a circuit board 120, on which an electronic component 8 is mounted, so as to cover the electronic component 8. A pad P is formed in a portion B on the circuit board 120, to which a thermosetting adhesive is applied, and a solder resist SR is formed around the pad P. Further, a protruding part D1 is provided on the pad P, and this structure effectively prevents the thermosetting adhesive from flowing from the pad P to the internal region Rin side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
