| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve bonding strength of a solder connection onto a circuit board. <P>SOLUTION: Terminal fittings 20L, 20M and 20S respectively comprise: terminal connections 21L, 21M and 21S which are substantially parallel to a circuit board P and whose proximal end side portions are exposed outside a housing 10; legs 22L, 22M and 22S which extend from proximal ends of the respective terminal connections 21L, 21M and 21S toward the circuit board P; and solder connections 23L, 23M and 23S which extend in substantially parallel to the circuit board P from extended ends of the respective legs 22L, 22M and 22S, and are bonded to the circuit board P via soldering. The plurality of terminal connections 21L, 21M and 21S are arranged in parallel to each other in a direction intersecting the circuit board P. Part of the solder connections 23M and 23S (inspection target portions 25M and 25S) extending from the terminal connections 21M and 21S which are on a side closer to the circuit board P is arranged at positions deviated, in a width direction, from the terminal connection 21L which is on a side further from the circuit board P. <P>COPYRIGHT: (C)2013,JPO&INPIT |
