| 摘要 |
<p>The invention concerns a coupling arrangement (1) for transfer of a microwave signal, the arrangement (1) comprising: - a motherboard (2) comprising a substrate (3) with a microstrip conductor (4), and - a module (5) comprising a substrate (6) with a microstrip conductor (7). Further, the module (5) is attached to the motherboard (2) such that the motherboard conductor (4) by means of a connection (17) is in electrical contact with the module conductor (7), whereby the microwave signal may be transferred between the motherboard conductor (4) and the module conductor (7). The invention is distinguished in that the connection (17) comprises the motherboard conductor (4) connected to a substrate integrated waveguide (8) on the motherboard (2), which substrate integrated waveguide (8) is connected to the module conductor (7) via a slot coupling (9).</p> |
