| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in adhesiveness to an inorganic substrate. <P>SOLUTION: This curable resin composition includes: a multifunctional thiol compound (A) with 200-2,000 molecular weight; a multifunctional epoxy resin (B) with 200-50,000 molecular weight and 80-6,000 g/mol epoxy equivalent; a thioether-containing alkoxysilane derivative (C) expressed by general formula (1); and an amine compound (D) with 90-700 molecular weight. The weight ratio ((A)/(B)) is 0.05-30. (C) of 0.5-50 pts.wt. and (D) of 0.01-50 pts.wt. are contained based on 100 pts.wt. (A+B). In the formula, m is 1 or 2; R<SP POS="POST">1</SP>is a bivalent group represented by any of -CH<SB POS="POST">2</SB>-CH(CH<SB POS="POST">3</SB>)-, -C(CH<SB POS="POST">3</SB>)<SB POS="POST">2</SB>-, -CH<SB POS="POST">2</SB>-CH<SB POS="POST">2</SB>- or -CH(CH<SB POS="POST">3</SB>)-; R<SP POS="POST">2</SP>is a methyl group or ethyl group; and R<SP POS="POST">3</SP>is a 1-18C hydrocarbon group or a 2-5C hydrocarbon group substituted by a 1-3C alkoxy group. <P>COPYRIGHT: (C)2013,JPO&INPIT |
