| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the size of a resin-sealed electronic control device obtained by bonding and fixing a circuit board onto a heat conductive base plate and integrating circuit components with the use of mold resin. <P>SOLUTION: A base 20 has: a first exposed portion 21a and a second exposed portion 21b; and an adjacent flat portion 22b which is adjacent to an intermediate window hole 22a. A first circuit component 31, which is a tall-profile, low-heat generation component, is arranged in the intermediate window hole 22a. A second circuit component 32, which is a low-profile, high-heat generation component, is arranged in the adjacent flat portion 22b. The height dimension of the tall-profile first circuit component 31 overlaps the thickness dimension of the base plate 20 so that the thickness dimension as a whole can be suppressed. In addition, since the high-heat generation component and the low-heat generation component are separated from each other, it is possible to suppress the area of a circuit board 30 by increasing the mounting density of the low-heat generation component. <P>COPYRIGHT: (C)2013,JPO&INPIT |
