| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder material by which fusion joining can be performed under the reflow heat treatment condition of a lead-free solder and which is not re-fused under the same condition after joining. <P>SOLUTION: The lead-free solder material comprises quinary alloy particles including, by mass, 13.5-16.5% Sn, 9-11% Ag, 4.5-5.5% Bi, 0.1-5% Ge, and the balance Cu as a main component. <P>COPYRIGHT: (C)2013,JPO&INPIT |
