发明名称 RESIN SEALING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an art capable of enhancing the manufacturing yield of moldings. <P>SOLUTION: A lower taper plate 25 having a tapered face 25a opposite to the tapered face 24a is shifted in a direction perpendicular to a mold open/close direction with respect to an upper taper plate 24 to slide between the tapered face 24a and the tapered face 25a, an insert block 22 is shifted in the open/close direction via the lower taper plate 25 to fix the clamp position. In a state that a work W is clamped with a second clamp force C2 larger than a first clamp force C1, a cavity 15a is completely filled with a molten resin 28a at a first resin pressure P1. Subsequently, in a state that the work W is clamped with a third clamp force C3 larger than the second clamp force C2, the molten resin 28a filled in the cavity 15a is pressurized at a second resin pressure P2 larger than the first resin pressure P1. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248780(A) 申请公布日期 2012.12.13
申请号 JP20110121286 申请日期 2011.05.31
申请人 APIC YAMADA CORP 发明人 TAKAHASHI YUICHI
分类号 H01L21/56;B29C45/02;B29C45/26;B29C45/56 主分类号 H01L21/56
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